DE

Daniel C. Edelstein

IBM: 17 patents #74 of 9,568Top 1%
📍 White Plains, NY: #1 of 119 inventorsTop 1%
🗺 New York: #31 of 10,473 inventorsTop 1%
Overall (2011): #1,009 of 364,097Top 1%
17
Patents 2011

Issued Patents 2011

Showing 1–17 of 17 patents

Patent #TitleCo-InventorsDate
8003520 Air gap structure having protective metal silicide pads on a metal feature Griselda Bonilla, Satyanarayana V. Nitta, Takeshi Nogami, Shom Ponoth, David L. Rath +1 more 2011-08-23
7998864 Noble metal cap for interconnect structures Chih-Chao Yang, Fenton R. McFeely 2011-08-16
7993817 Structure with self aligned resist layer on an insulating surface and method of making same Elbert E. Huang, Robert D. Miller 2011-08-09
7977032 Method to create region specific exposure in a layer Christos D. Dimitrakopoulos, Vincent J. McGahay, Satyanarayana V. Nitta, Kevin S. Petrarca, Shom Ponoth +1 more 2011-07-12
7968949 Contact forming method and related semiconductor device Louis L. Hsu, Chih-Chao Yang 2011-06-28
7964966 Via gouged interconnect structure and method of fabricating same Chih-Chao Yang, Theodorus E. Standaert 2011-06-21
7956463 Large grain size conductive structure for narrow interconnect openings Chih-Chao Yang, Takeshi Nogami, Stephen M. Rossnagel 2011-06-07
7955971 Hybrid metallic wire and methods of fabricating same Chih-Chao Yang, Kaushik Chanda, Baozhen Li 2011-06-07
7951714 High aspect ratio electroplated metal feature and method Keith Kwong Hon Wong, Chih-Chao Yang, Haining Yang 2011-05-31
7951708 Copper interconnect structure with amorphous tantalum iridium diffusion barrier Patrick W. DeHaven, Philip L. Flaitz, Takeshi Nogami, Stephen M. Rossnagel, Chih-Chao Yang 2011-05-31
7943480 Sub-lithographic dimensioned air gap formation and related structure Nicholas C. M. Fuller, David V. Horak, Elbert E. Huang, Wai-Kin Li, Anthony D. Lisi +2 more 2011-05-17
7928569 Redundant barrier structure for interconnect and wiring applications, design structure and method of manufacture Chih-Chao Yang 2011-04-19
7892940 Device and methodology for reducing effective dielectric constant in semiconductor devices Matthew E. Colburn, Edward C. Cooney, III, Timothy J. Dalton, John A. Fitzsimmons, Jeffrey P. Gambino +10 more 2011-02-22
7892648 SiCOH dielectric material with improved toughness and improved Si-C bonding Stephen M. Gates, Alfred Grill, Michael Lane, Robert D. Miller, Deborah A. Neumayer +1 more 2011-02-22
7888741 Structures with improved interfacial strength of SiCOH dielectrics and method for preparing the same Alfred Grill, Vishnubhai V. Patel, Darryl D. Restaino 2011-02-15
7884477 Air gap structure having protective metal silicide pads on a metal feature Griselda Bonilla, Satyanarayana V. Nitta, Takeshi Nogami, Shom Ponoth, David L. Rath +1 more 2011-02-08
7863150 Method to generate airgaps with a template first scheme and a self aligned blockout mask Matthew E. Colburn, Satya V. Nitta, Sampath Purushothaman, Shom Ponth 2011-01-04