Issued Patents 2011
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8021974 | Structure and method for back end of the line integration | Chih-Chao Yang, David V. Horak, Shom Ponoth | 2011-09-20 |
| 8008669 | Programmable anti-fuse structure with DLC dielectric layer | Chih-Chao Yang, David V. Horak, Shom Ponoth | 2011-08-30 |
| 8003520 | Air gap structure having protective metal silicide pads on a metal feature | Griselda Bonilla, Daniel C. Edelstein, Satyanarayana V. Nitta, Shom Ponoth, David L. Rath +1 more | 2011-08-23 |
| 7956463 | Large grain size conductive structure for narrow interconnect openings | Chih-Chao Yang, Daniel C. Edelstein, Stephen M. Rossnagel | 2011-06-07 |
| 7951708 | Copper interconnect structure with amorphous tantalum iridium diffusion barrier | Patrick W. DeHaven, Daniel C. Edelstein, Philip L. Flaitz, Stephen M. Rossnagel, Chih-Chao Yang | 2011-05-31 |
| 7928570 | Interconnect structure | Shom Ponoth, David V. Horak, Chih-Chao Yang | 2011-04-19 |
| 7892968 | Via gouging methods and related semiconductor structure | Shyng-Tsong Chen, Steven J. Holmes, David V. Horak, Shom Ponoth, Chih-Chao Yang | 2011-02-22 |
| 7884477 | Air gap structure having protective metal silicide pads on a metal feature | Griselda Bonilla, Daniel C. Edelstein, Satyanarayana V. Nitta, Shom Ponoth, David L. Rath +1 more | 2011-02-08 |