Issued Patents 2011
Showing 1–25 of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8075661 | Ultra-hard composite material and method for manufacturing the same | Chi-San Chen, Jien-Wei Yeh, Chin-Te Huang | 2011-12-13 |
| 8053257 | Method for prediction of premature dielectric breakdown in a semiconductor | Kaushik Chanda, Hazara S. Rathore, Paul S. McLaughlin, Robert D. Edwards, Lawrence A. Clevenger +2 more | 2011-11-08 |
| 8039966 | Structures of and methods and tools for forming in-situ metallic/dielectric caps for interconnects | Chao-Kun Hu | 2011-10-18 |
| 8034710 | Bilayer metal capping layer for interconnect applications | Satya V. Nitta | 2011-10-11 |
| 8035228 | High-density 3-dimensional resistors | — | 2011-10-11 |
| 8023305 | High density planar magnetic domain wall memory apparatus | Michael C. Gaidis, Lawrence A. Clevenger, Timothy J. Dalton, John K. DeBrosse, Louis L. Hsu +2 more | 2011-09-20 |
| 8021974 | Structure and method for back end of the line integration | David V. Horak, Takeshi Nogami, Shom Ponoth | 2011-09-20 |
| 8013446 | Nitrogen-containing metal cap for interconnect structures | Chao-Kun Hu | 2011-09-06 |
| 8009453 | High density planar magnetic domain wall memory apparatus | Michael C. Gaidis, Lawrence A. Clevenger, Timothy J. Dalton, John K. DeBrosse, Louis L. Hsu +2 more | 2011-08-30 |
| 8008669 | Programmable anti-fuse structure with DLC dielectric layer | David V. Horak, Takeshi Nogami, Shom Ponoth | 2011-08-30 |
| 8003524 | Plating seed layer including an oxygen/nitrogen transition region for barrier enhancement | Simon Gaudet, Christian Lavoie, Shom Ponoth, Terry A. Spooner | 2011-08-23 |
| 8003520 | Air gap structure having protective metal silicide pads on a metal feature | Griselda Bonilla, Daniel C. Edelstein, Satyanarayana V. Nitta, Takeshi Nogami, Shom Ponoth +1 more | 2011-08-23 |
| 7998864 | Noble metal cap for interconnect structures | Daniel C. Edelstein, Fenton R. McFeely | 2011-08-16 |
| 7984409 | Structures incorporating interconnect structures with improved electromigration resistance | Louis L. Hsu, Jack A. Mandelman, William R. Tonti | 2011-07-19 |
| 7973409 | Hybrid interconnect structure for performance improvement and reliability enhancement | Thomas M. Shaw, Keith Kwong Hon Wong, Haining Yang | 2011-07-05 |
| 7968949 | Contact forming method and related semiconductor device | Daniel C. Edelstein, Louis L. Hsu | 2011-06-28 |
| 7964497 | Structure to facilitate plating into high aspect ratio vias | Fenton R. McFeely | 2011-06-21 |
| 7964966 | Via gouged interconnect structure and method of fabricating same | Daniel C. Edelstein, Theodorus E. Standaert | 2011-06-21 |
| 7960274 | Structure and method for creating reliable via contacts for interconnect applications | Oscar van der Straten | 2011-06-14 |
| 7960276 | Conductor-dielectric structure and method for fabricating | Shom Ponoth, David L. Rath, Keith Kwong Hon Wong | 2011-06-14 |
| 7956466 | Structure for interconnect structure containing various capping materials for electrical fuse and other related applications | Louis L. Hsu, William R. Tonti | 2011-06-07 |
| 7955952 | Crackstop structures and methods of making same | Xiao Hu Liu, Haining Yang | 2011-06-07 |
| 7955971 | Hybrid metallic wire and methods of fabricating same | Kaushik Chanda, Daniel C. Edelstein, Baozhen Li | 2011-06-07 |
| 7956463 | Large grain size conductive structure for narrow interconnect openings | Daniel C. Edelstein, Takeshi Nogami, Stephen M. Rossnagel | 2011-06-07 |
| 7951708 | Copper interconnect structure with amorphous tantalum iridium diffusion barrier | Patrick W. DeHaven, Daniel C. Edelstein, Philip L. Flaitz, Takeshi Nogami, Stephen M. Rossnagel | 2011-05-31 |