Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7951708 | Copper interconnect structure with amorphous tantalum iridium diffusion barrier | Patrick W. DeHaven, Daniel C. Edelstein, Takeshi Nogami, Stephen M. Rossnagel, Chih-Chao Yang | 2011-05-31 |