Issued Patents 2011
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8056039 | Interconnect structure for integrated circuits having improved electromigration characteristics | Kaushik Chanda, Ronald G. Filippi, Stephan Grunow, Sujatha Sankaran, Andrew H. Simon +1 more | 2011-11-08 |
| 8039966 | Structures of and methods and tools for forming in-situ metallic/dielectric caps for interconnects | Chih-Chao Yang | 2011-10-18 |
| 8026166 | Interconnect structures comprising capping layers with low dielectric constants and methods of making the same | Griselda Bonilla, Tien-Jen Cheng, Lawrence A. Clevenger, Stephan Grunow, Roger A. Quon +5 more | 2011-09-27 |
| 8013446 | Nitrogen-containing metal cap for interconnect structures | Chih-Chao Yang | 2011-09-06 |
| 7893520 | Efficient interconnect structure for electrical fuse applications | Chih-Chao Yang, Lynne M. Gignac | 2011-02-22 |