Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8026166 | Interconnect structures comprising capping layers with low dielectric constants and methods of making the same | Griselda Bonilla, Tien-Jen Cheng, Lawrence A. Clevenger, Stephan Grunow, Chao-Kun Hu +5 more | 2011-09-27 |
| 7923836 | BLM structure for application to copper pad | Mukta G. Farooq, Tien-Jen Cheng | 2011-04-12 |
| 7926006 | Variable fill and cheese for mitigation of BEOL topography | Todd C. Bailey, Ryan P. Deschner, Wai-Kin Li | 2011-04-12 |