Issued Patents 2011
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8076756 | Structure for inhibiting back end of line damage from dicing and chip packaging interaction failures | Michael Lane, Xiao Hu Liu, Thomas M. Shaw, Robert Hannon, Ian D. Melville | 2011-12-13 |
| 8039964 | Fluorine depleted adhesion layer for metal interconnect structure | Emily R. Kinser | 2011-10-18 |
| 8022543 | Underbump metallurgy for enhanced electromigration resistance | Robert Hannon, Emily R. Kinser, Ian D. Melville | 2011-09-20 |
| 8017997 | Vertical metal-insulator-metal (MIM) capacitor using gate stack, gate spacer and contact via | Ramachandra Divakaruni, Jeffrey P. Gambino, Kevin S. Petrarca | 2011-09-13 |
| 7955955 | Using crack arrestor for inhibiting damage from dicing and chip packaging interaction failures in back end of line structures | Michael Lane, Xiao Hu Liu, Thomas M. Shaw, Robert Hannon, Ian D. Melville | 2011-06-07 |
| 7939369 | 3D integration structure and method using bonded metal planes | Subramanian S. Iyer | 2011-05-10 |
| 7923836 | BLM structure for application to copper pad | Tien-Jen Cheng, Roger A. Quon | 2011-04-12 |
| 7919356 | Method and structure to reduce cracking in flip chip underfill | Robert Hannon, Dae Young Jung, Ian D. Melville | 2011-04-05 |
| 7900809 | Solder interconnection array with optimal mechanical integrity | Glenn G. Daves, David L. Edwards, Frank L. Pompeo | 2011-03-08 |
| 7882623 | Apparatus for removing interconnects to separate two parts of a workpiece | Ray Jackson, David C. Linnell, Frank L. Pompeo | 2011-02-08 |
| 7867887 | Structure and method for enhancing resistance to fracture of bonding pads | Ian D. Melville, Dae Young Jung | 2011-01-11 |