Issued Patents 2011
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8076756 | Structure for inhibiting back end of line damage from dicing and chip packaging interaction failures | Michael Lane, Xiao Hu Liu, Thomas M. Shaw, Mukta G. Farooq, Robert Hannon | 2011-12-13 |
| 8022543 | Underbump metallurgy for enhanced electromigration resistance | Mukta G. Farooq, Robert Hannon, Emily R. Kinser | 2011-09-20 |
| 7955955 | Using crack arrestor for inhibiting damage from dicing and chip packaging interaction failures in back end of line structures | Michael Lane, Xiao Hu Liu, Thomas M. Shaw, Mukta G. Farooq, Robert Hannon | 2011-06-07 |
| 7919356 | Method and structure to reduce cracking in flip chip underfill | Mukta G. Farooq, Robert Hannon, Dae Young Jung | 2011-04-05 |
| 7875502 | Semiconductor chips with crack stop regions for reducing crack propagation from chip edges/corners | Peter J. Brofman, Jon A. Casey, David L. Questad, Wolfgang Sauter, Thomas A. Wassick | 2011-01-25 |
| 7867887 | Structure and method for enhancing resistance to fracture of bonding pads | Mukta G. Farooq, Dae Young Jung | 2011-01-11 |