Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8039964 | Fluorine depleted adhesion layer for metal interconnect structure | Mukta G. Farooq | 2011-10-18 |
| 8022543 | Underbump metallurgy for enhanced electromigration resistance | Mukta G. Farooq, Robert Hannon, Ian D. Melville | 2011-09-20 |
| 7910484 | Method for preventing backside defects in dielectric layers formed on semiconductor substrates | Chester T. Dziobkowski, Thomas Houghton, Darryl D. Restaino, Yun-Yu Wang | 2011-03-22 |