Issued Patents 2011
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8076756 | Structure for inhibiting back end of line damage from dicing and chip packaging interaction failures | Michael Lane, Xiao Hu Liu, Mukta G. Farooq, Robert Hannon, Ian D. Melville | 2011-12-13 |
| 7972965 | Process for interfacial adhesion in laminate structures through patterned roughing of a surface | Edward C. Cooney, III, Vincent J. McGahay, Anthony K. Stamper, Matthew E. Colburn | 2011-07-05 |
| 7973409 | Hybrid interconnect structure for performance improvement and reliability enhancement | Chih-Chao Yang, Keith Kwong Hon Wong, Haining Yang | 2011-07-05 |
| 7955955 | Using crack arrestor for inhibiting damage from dicing and chip packaging interaction failures in back end of line structures | Michael Lane, Xiao Hu Liu, Mukta G. Farooq, Robert Hannon, Ian D. Melville | 2011-06-07 |
| 7892940 | Device and methodology for reducing effective dielectric constant in semiconductor devices | Daniel C. Edelstein, Matthew E. Colburn, Edward C. Cooney, III, Timothy J. Dalton, John A. Fitzsimmons +10 more | 2011-02-22 |