AS

Anthony K. Stamper

IBM: 28 patents #14 of 9,568Top 1%
📍 Burlington, VT: #2 of 41 inventorsTop 5%
🗺 Vermont: #3 of 615 inventorsTop 1%
Overall (2011): #277 of 364,097Top 1%
28
Patents 2011

Issued Patents 2011

Showing 1–25 of 28 patents

Patent #TitleCo-InventorsDate
8052799 By-product collecting processes for cleaning processes Edward C. Cooney, III, William J. Murphy, David C. Strippe 2011-11-08
8053901 Sacrificial inorganic polymer intermetal dielectric damascene wire and via liner Jeffrey P. Gambino 2011-11-08
8039356 Through silicon via lithographic alignment and registration Russell T. Herrin, Peter J. Lindgren, Edmund J. Sprogis 2011-10-18
8039354 Passive components in the back end of integrated circuits Anil K. Chinthakindi, Douglas D. Coolbaugh, Ebenezer E. Eshun, Zhong-Xiang He, Jeffrey B. Johnson +2 more 2011-10-18
8035198 Through wafer via and method of making same Hanyi Ding, Alvin J. Joseph 2011-10-11
8028924 Device and method for providing an integrated circuit with a unique identification Brent A. Anderson, Andres Bryant, Alain Loiseau, Mickey H. Yu 2011-10-04
8026606 Interconnect layers without electromigration Stephen E. Luce, Thomas L. McDevitt 2011-09-27
8013367 Structure and method for compact long-channel FETs Bruce B. Doris, Carl Radens 2011-09-06
8013342 Double-sided integrated circuit chips Kerry Bernstein, Timothy J. Dalton, Jeffrey P. Gambino, Mark D. Jaffe, Paul D. Kartschoke +1 more 2011-09-06
7994895 Heat sink for integrated circuit devices Douglas D. Coolbaugh, Ebenezer E. Eshun, Terence B. Hook, Robert M. Rassel, Edmund J. Sprogis +1 more 2011-08-09
7989312 Double-sided integrated circuit chips Kerry Bernstein, Timothy J. Dalton, Jeffrey P. Gambino, Mark D. Jaffe, Paul D. Kartschoke +1 more 2011-08-02
7972965 Process for interfacial adhesion in laminate structures through patterned roughing of a surface Edward C. Cooney, III, Vincent J. McGahay, Thomas M. Shaw, Matthew E. Colburn 2011-07-05
7968975 Metal wiring structure for integration with through substrate vias David S. Collins, Alvin J. Joseph, Peter J. Lindgren, Kimball M. Watson 2011-06-28
7960245 Dual wired integrated circuit chips Kerry Bernstein, Timothy J. Dalton, Jeffrey P. Gambino, Mark D. Jaffe, Paul D. Kartschoke 2011-06-14
7943428 Bonded semiconductor substrate including a cooling mechanism Jeffrey P. Gambino 2011-05-17
7939914 Dual wired integrated circuit chips Kerry Bernstein, Timothy J. Dalton, Jeffrey P. Gambino, Mark D. Jaffe, Paul D. Kartschoke 2011-05-10
7928513 Protection against charging damage in hybrid orientation transistors Terence B. Hook, Anda C. Mocuta, Jeffrey W. Sleight 2011-04-19
7930667 System and method of automated wire and via layout optimization description Bette L. Bergman Reuter, Howard S. Landis, Jeanne-Tania Sucharitaves 2011-04-19
7915134 Method of integration of a MIM capacitor with a lower plate of metal gate material formed on an STI region or a silicide region formed in or on the surface of a doped well with a high K dielectric material Anil K. Chinthakindi, Douglas D. Coolbaugh, Keith E. Downes, Ebenezer E. Eshun, Zhong-Xiang He +2 more 2011-03-29
7915162 Method of forming damascene filament wires Brent A. Anderson, Andres Bryant, Jeffrey P. Gambino 2011-03-29
7915158 Method for forming an on-chip high frequency electro-static discharge device Hanyi Ding, Kai D. Feng, Zhong-Xiang He, Xuefeng Liu 2011-03-29
7910450 Method of fabricating a precision buried resistor Anil K. Chinthakindi, Douglas D. Coolbaugh, Keith E. Downes, Ebenezer E. Eshun, John E. Florkey +3 more 2011-03-22
7902629 Integrated BEOL thin film resistor Anil K. Chinthakindi, Douglas D. Coolbaugh, John M. Cotte, Ebenezer E. Eshun, Zhong-Xiang He +1 more 2011-03-08
7898063 Through substrate annular via including plug filler Peter J. Lindgren, Edmund J. Sprogis, Kenneth J. Stein 2011-03-01
7892940 Device and methodology for reducing effective dielectric constant in semiconductor devices Daniel C. Edelstein, Matthew E. Colburn, Edward C. Cooney, III, Timothy J. Dalton, John A. Fitzsimmons +10 more 2011-02-22