Issued Patents 2011
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8084864 | Electromigration resistant aluminum-based metal interconnect structure | Jonathan D. Chapple-Sokol, Daniel A. Delibac, Zhong-Xiang He, Tom C. Lee, Timothy D. Sullivan +2 more | 2011-12-27 |
| 8052799 | By-product collecting processes for cleaning processes | Edward C. Cooney, III, Anthony K. Stamper, David C. Strippe | 2011-11-08 |
| 8003536 | Electromigration resistant aluminum-based metal interconnect structure | Jonathan D. Chapple-Sokol, Daniel A. Delibac, Zhong-Xiang He, Tom C. Lee, Timothy D. Sullivan +2 more | 2011-08-23 |
| 7994895 | Heat sink for integrated circuit devices | Douglas D. Coolbaugh, Ebenezer E. Eshun, Terence B. Hook, Robert M. Rassel, Edmund J. Sprogis +1 more | 2011-08-09 |
| 7879716 | Metal seed layer deposition | Steven P. Barkyoumb, Jonathan D. Chapple-Sokol, Edward C. Cooney, III, Keith E. Downes, Thomas L. McDevitt | 2011-02-01 |