Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8026606 | Interconnect layers without electromigration | Stephen E. Luce, Anthony K. Stamper | 2011-09-27 |
| 7879716 | Metal seed layer deposition | Steven P. Barkyoumb, Jonathan D. Chapple-Sokol, Edward C. Cooney, III, Keith E. Downes, William J. Murphy | 2011-02-01 |