Issued Patents 2011
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8044764 | Resistor and design structure having resistor material length with sub-lithographic width | Mark C. Hakey, James S. Nakos | 2011-10-25 |
| 8026606 | Interconnect layers without electromigration | Thomas L. McDevitt, Anthony K. Stamper | 2011-09-27 |
| 8013342 | Double-sided integrated circuit chips | Kerry Bernstein, Timothy J. Dalton, Jeffrey P. Gambino, Mark D. Jaffe, Paul D. Kartschoke +1 more | 2011-09-06 |
| 8004289 | Wafer-to-wafer alignments | Thomas Joseph Dalton, Jeffrey P. Gambino, Mark D. Jaffe, Edmund J. Sprogis | 2011-08-23 |
| 7989312 | Double-sided integrated circuit chips | Kerry Bernstein, Timothy J. Dalton, Jeffrey P. Gambino, Mark D. Jaffe, Paul D. Kartschoke +1 more | 2011-08-02 |
| 7977200 | Charge breakdown avoidance for MIM elements in SOI base technology and method | William F. Clark, Jr. | 2011-07-12 |
| 7884475 | Conductor structure including manganese oxide capping layer | Jeffrey P. Gambino | 2011-02-08 |