Issued Patents 2011
Showing 1–25 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8053901 | Sacrificial inorganic polymer intermetal dielectric damascene wire and via liner | Anthony K. Stamper | 2011-11-08 |
| 8053814 | On-chip embedded thermal antenna for chip cooling | Fen Chen, Alvin W. Strong | 2011-11-08 |
| 8039888 | Conductive spacers for semiconductor devices and methods of forming | Gary B. Bronner, David M. Fried, Leland Chang, Ramachandra Divakaruni, Haizhou Yin +2 more | 2011-10-18 |
| 8021950 | Semiconductor wafer processing method that allows device regions to be selectively annealed following back end of the line (BEOL) metal wiring layer formation | Wagdi W. Abadeer, John J. Ellis-Monaghan, Tom C. Lee | 2011-09-20 |
| 8017514 | Optically transparent wires for secure circuits and methods of making same | Stephen P. Ayotte, Timothy D. Sullivan, Kimball M. Watson | 2011-09-13 |
| 8017997 | Vertical metal-insulator-metal (MIM) capacitor using gate stack, gate spacer and contact via | Ramachandra Divakaruni, Mukta G. Farooq, Kevin S. Petrarca | 2011-09-13 |
| 8017995 | Deep trench semiconductor structure and method | Benjamin T. Voegeli, Steven H. Voldman, Michael J. Zierak | 2011-09-13 |
| 8013342 | Double-sided integrated circuit chips | Kerry Bernstein, Timothy J. Dalton, Mark D. Jaffe, Paul D. Kartschoke, Stephen E. Luce +1 more | 2011-09-06 |
| 8004289 | Wafer-to-wafer alignments | Thomas Joseph Dalton, Mark D. Jaffe, Stephen E. Luce, Edmund J. Sprogis | 2011-08-23 |
| 8003428 | Method of forming an inverted lens in a semiconductor structure | Terence W. Barrett, Robert K. Leidy | 2011-08-23 |
| 8003425 | Methods for forming anti-reflection structures for CMOS image sensors | James W. Adkisson, John J. Ellis-Monaghan, Charles F. Musante | 2011-08-23 |
| 7989358 | Prevention of backside cracks in semiconductor chips or wafers using backside film or backside wet etch | Timothy H. Daubenspeck, Jerome B. Lasky, Christopher D. Muzzy, Wolfgang Sauter | 2011-08-02 |
| 7989312 | Double-sided integrated circuit chips | Kerry Bernstein, Timothy J. Dalton, Mark D. Jaffe, Paul D. Kartschoke, Stephen E. Luce +1 more | 2011-08-02 |
| 7985671 | Structures and methods for improving solder bump connections in semiconductor devices | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2011-07-26 |
| 7964967 | High surface area aluminum bond pad for through-wafer connections to an electronic package | James W. Adkisson, Mark D. Jaffe, Richard J. Rassel, Edmund J. Sprogis | 2011-06-21 |
| 7960245 | Dual wired integrated circuit chips | Kerry Bernstein, Timothy J. Dalton, Mark D. Jaffe, Paul D. Kartschoke, Anthony K. Stamper | 2011-06-14 |
| 7958477 | Structure, failure analysis tool and method of determining white bump location using failure analysis tool | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter, Jeffrey S. Zimmerman | 2011-06-07 |
| 7956412 | Lateral diffusion field effect transistor with a trench field plate | Natalie B. Feilchenfeld, Louis D. Lanzerotti, Benjamin T. Voegeli, Steven H. Voldman, Michael J. Zierak | 2011-06-07 |
| 7943428 | Bonded semiconductor substrate including a cooling mechanism | Anthony K. Stamper | 2011-05-17 |
| 7939914 | Dual wired integrated circuit chips | Kerry Bernstein, Timothy J. Dalton, Mark D. Jaffe, Paul D. Kartschoke, Anthony K. Stamper | 2011-05-10 |
| 7939390 | Gap capacitors for monitoring stress in solder balls in flip chip technology | Stephen P. Ayotte, Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter | 2011-05-10 |
| 7935638 | Methods and structures for enhancing perimeter-to-surface area homogeneity | James A. Culp, John J. Ellis-Monaghan, Kirk D. Peterson, Jed H. Rankin | 2011-05-03 |
| 7935604 | Method of making small geometry features | James W. Adkisson, Robert K. Leidy, Walter V. Lepuschenko, David Alan Meatyard, Stephen A. Mongeon +1 more | 2011-05-03 |
| 7935408 | Substrate anchor structure and method | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter | 2011-05-03 |
| 7928527 | Delamination and crack resistant image sensor structures and methods | Mark D. Jaffe, Robert K. Leidy, Charles F. Musante, Richard J. Rassel | 2011-04-19 |