Issued Patents 2011
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8084864 | Electromigration resistant aluminum-based metal interconnect structure | Jonathan D. Chapple-Sokol, Daniel A. Delibac, Zhong-Xiang He, Tom C. Lee, William J. Murphy +2 more | 2011-12-27 |
| 8084858 | Metal wiring structures for uniform current density in C4 balls | Timothy H. Daubenspeck, Wolfgang Sauter, Steven L. Wright, Edmund J. Sprogis | 2011-12-27 |
| 8017514 | Optically transparent wires for secure circuits and methods of making same | Stephen P. Ayotte, Jeffrey P. Gambino, Kimball M. Watson | 2011-09-13 |
| 8018017 | Thermo-mechanical cleavable structure | Fen Chen, Cathryn J. Christiansen, Richard S. Kontra, Tom C. Lee, Alvin W. Strong +1 more | 2011-09-13 |
| 8003536 | Electromigration resistant aluminum-based metal interconnect structure | Jonathan D. Chapple-Sokol, Daniel A. Delibac, Zhong-Xiang He, Tom C. Lee, William J. Murphy +2 more | 2011-08-23 |
| 7985671 | Structures and methods for improving solder bump connections in semiconductor devices | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2011-07-26 |
| 7890893 | Design structure for semiconductor on-chip repair scheme for negative bias temperature instability | Ronald J. Bolam, Tom C. Lee | 2011-02-15 |
| 7875854 | Design structure for alpha particle sensor in SOI technology and structure thereof | Ethan H. Cannon, Michael J. Hauser | 2011-01-25 |
| 7871919 | Structures and methods for improving solder bump connections in semiconductor devices | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2011-01-18 |
| 7868453 | Solder interconnect pads with current spreading layers | Timothy H. Daubenspeck | 2011-01-11 |