Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8084864 | Electromigration resistant aluminum-based metal interconnect structure | Daniel A. Delibac, Zhong-Xiang He, Tom C. Lee, William J. Murphy, Timothy D. Sullivan +2 more | 2011-12-27 |
| 8003536 | Electromigration resistant aluminum-based metal interconnect structure | Daniel A. Delibac, Zhong-Xiang He, Tom C. Lee, William J. Murphy, Timothy D. Sullivan +2 more | 2011-08-23 |
| 7879716 | Metal seed layer deposition | Steven P. Barkyoumb, Edward C. Cooney, III, Keith E. Downes, Thomas L. McDevitt, William J. Murphy | 2011-02-01 |