DD

Daniel A. Delibac

IBM: 2 patents #2,055 of 9,568Top 25%
📍 Colchester, VT: #16 of 55 inventorsTop 30%
🗺 Vermont: #161 of 615 inventorsTop 30%
Overall (2011): #105,840 of 364,097Top 30%
2
Patents 2011

Issued Patents 2011

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
8084864 Electromigration resistant aluminum-based metal interconnect structure Jonathan D. Chapple-Sokol, Zhong-Xiang He, Tom C. Lee, William J. Murphy, Timothy D. Sullivan +2 more 2011-12-27
8003536 Electromigration resistant aluminum-based metal interconnect structure Jonathan D. Chapple-Sokol, Zhong-Xiang He, Tom C. Lee, William J. Murphy, Timothy D. Sullivan +2 more 2011-08-23