Issued Patents 2011
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8084858 | Metal wiring structures for uniform current density in C4 balls | Wolfgang Sauter, Timothy D. Sullivan, Steven L. Wright, Edmund J. Sprogis | 2011-12-27 |
| 7989358 | Prevention of backside cracks in semiconductor chips or wafers using backside film or backside wet etch | Jeffrey P. Gambino, Jerome B. Lasky, Christopher D. Muzzy, Wolfgang Sauter | 2011-08-02 |
| 7985671 | Structures and methods for improving solder bump connections in semiconductor devices | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2011-07-26 |
| 7958477 | Structure, failure analysis tool and method of determining white bump location using failure analysis tool | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Jeffrey S. Zimmerman | 2011-06-07 |
| 7939390 | Gap capacitors for monitoring stress in solder balls in flip chip technology | Stephen P. Ayotte, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2011-05-10 |
| 7935408 | Substrate anchor structure and method | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2011-05-03 |
| 7911803 | Current distribution structure and method | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2011-03-22 |
| 7910408 | Damage propagation barrier and method of forming | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2011-03-22 |
| 7871920 | Semiconductor chips with reduced stress from underfill at edge of chip | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2011-01-18 |
| 7871919 | Structures and methods for improving solder bump connections in semiconductor devices | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2011-01-18 |
| 7868453 | Solder interconnect pads with current spreading layers | Timothy D. Sullivan | 2011-01-11 |
| 7862987 | Method for forming an electrical structure comprising multiple photosensitive materials | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2011-01-04 |
| 7863734 | Dual-sided chip attached modules | Kerry Bernstein, Timothy J. Dalton, Jeffrey P. Gambino, Mark D. Jaffe, Christopher D. Muzzy +3 more | 2011-01-04 |
| 7863183 | Method for fabricating last level copper-to-C4 connection with interfacial cap structure | William Francis Landers, Donna S. Zupanski-Nielsen | 2011-01-04 |