Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8026613 | Interconnections for flip-chip using lead-free solders and having reaction barrier layers | Keith E. Fogel, Balaram Ghosal, Sung Kwon Kang, Stephen Kilpatrick, Paul A. Lauro +2 more | 2011-09-27 |
| 7923849 | Interconnections for flip-chip using lead-free solders and having reaction barrier layers | Keith E. Fogel, Balaram Ghosal, Sung Kwon Kang, Stephen Kilpatrick, Paul A. Lauro +2 more | 2011-04-12 |
| 7863183 | Method for fabricating last level copper-to-C4 connection with interfacial cap structure | Timothy H. Daubenspeck, William Francis Landers | 2011-01-04 |