Issued Patents 2011
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8084858 | Metal wiring structures for uniform current density in C4 balls | Timothy H. Daubenspeck, Wolfgang Sauter, Timothy D. Sullivan, Steven L. Wright | 2011-12-27 |
| 8039356 | Through silicon via lithographic alignment and registration | Russell T. Herrin, Peter J. Lindgren, Anthony K. Stamper | 2011-10-18 |
| 8004289 | Wafer-to-wafer alignments | Thomas Joseph Dalton, Jeffrey P. Gambino, Mark D. Jaffe, Stephen E. Luce | 2011-08-23 |
| 7994895 | Heat sink for integrated circuit devices | Douglas D. Coolbaugh, Ebenezer E. Eshun, Terence B. Hook, Robert M. Rassel, Anthony K. Stamper +1 more | 2011-08-09 |
| 7964967 | High surface area aluminum bond pad for through-wafer connections to an electronic package | James W. Adkisson, Jeffrey P. Gambino, Mark D. Jaffe, Richard J. Rassel | 2011-06-21 |
| 7932614 | Method of thinning a semiconductor substrate | Steven R. Codding, Timothy C. Krywanczyk, Timothy E. Neary | 2011-04-26 |
| 7898063 | Through substrate annular via including plug filler | Peter J. Lindgren, Anthony K. Stamper, Kenneth J. Stein | 2011-03-01 |
| 7867876 | Method of thinning a semiconductor substrate | Steven R. Codding, Timothy C. Krywanczyk, Timothy E. Neary | 2011-01-11 |
| 7863734 | Dual-sided chip attached modules | Kerry Bernstein, Timothy J. Dalton, Timothy H. Daubenspeck, Jeffrey P. Gambino, Mark D. Jaffe +3 more | 2011-01-04 |