Issued Patents 2011
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8039314 | Metal adhesion by induced surface roughness | Danielle DeGraw, Da-Yuan Shih, Ping-Chuan Wang | 2011-10-18 |
| 8039356 | Through silicon via lithographic alignment and registration | Russell T. Herrin, Edmund J. Sprogis, Anthony K. Stamper | 2011-10-18 |
| 7968975 | Metal wiring structure for integration with through substrate vias | David S. Collins, Alvin J. Joseph, Anthony K. Stamper, Kimball M. Watson | 2011-06-28 |
| 7898063 | Through substrate annular via including plug filler | Edmund J. Sprogis, Anthony K. Stamper, Kenneth J. Stein | 2011-03-01 |
| 7863180 | Through substrate via including variable sidewall profile | Edward C. Cooney, III, Dorreen Jane Ossenkop, Anthony K. Stamper | 2011-01-04 |