Issued Patents 2011
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8039314 | Metal adhesion by induced surface roughness | Danielle DeGraw, Peter J. Lindgren, Da-Yuan Shih | 2011-10-18 |
| 8030113 | Thermoelectric 3D cooling | Louis L. Hsu, Xiaojin Wei, Huilong Zhu | 2011-10-04 |
| 8003474 | Electrically programmable fuse and fabrication method | Kaushik Chanda, Ronald G. Filippi, Joseph M. Lukaitis | 2011-08-23 |
| 7979440 | System and article of manufacture for efficient evaluation of index screening predicates | You-Chin Fuh, Li Xia, Binghua Zhen | 2011-07-12 |
| 7961032 | Method of and structure for recovering gain in a bipolar transistor | Zhijian Yang, Kai D. Feng | 2011-06-14 |
| 7930664 | Programmable through silicon via | Kai D. Feng, Louis L. Hsu, Zhijian Yang | 2011-04-19 |
| 7919834 | Edge seal for thru-silicon-via technology | Robert Edgar Davis, Robert D. Edwards, J. Edwin Hostetter, Kimball M. Watson | 2011-04-05 |
| 7911263 | Leakage current mitigation in a semiconductor device | Jong-Ru Guo, Louis L. Hsu, Rajiv V. Joshi, Zhijian Yang | 2011-03-22 |
| 7904868 | Structures including means for lateral current carrying capability improvement in semiconductor devices | Natalie B. Feilchenfeld, Zhong-Xiang He, Qizhi Liu, BethAnn Rainey, Kimball M. Watson | 2011-03-08 |
| 7904273 | In-line depth measurement for thru silicon via | Qizhi Liu, Kimball M. Watson, Zhijian Yang | 2011-03-08 |
| 7893529 | Thermoelectric 3D cooling | Louis L. Hsu, Xiaojin Wei, Huilong Zhu | 2011-02-22 |
| 7890442 | Method and system for autocompletion of multiple fields in electronic forms | Robert C. Weir, Asima Silva | 2011-02-15 |
| 7863960 | Three-dimensional chip-stack synchronization | Anthony R. Bonaccio, Jong-Ru Guo, Louis L. Hsu | 2011-01-04 |