Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8053284 | Method and package for circuit chip packaging | Sushumna Iruvanti, Yves Martin, Theodore Kessel | 2011-11-08 |
| 8030113 | Thermoelectric 3D cooling | Louis L. Hsu, Ping-Chuan Wang, Huilong Zhu | 2011-10-04 |
| 7928562 | Segmentation of a die stack for 3D packaging thermal management | Amilcar R. Arvelo, Evan G. Colgan, John Harold Magerlein, Kenneth C. Marston, Kathryn C. Rivera +3 more | 2011-04-19 |
| 7893529 | Thermoelectric 3D cooling | Louis L. Hsu, Ping-Chuan Wang, Huilong Zhu | 2011-02-22 |