Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7928562 | Segmentation of a die stack for 3D packaging thermal management | Amilcar R. Arvelo, Evan G. Colgan, John Harold Magerlein, Kathryn C. Rivera, Kamal K. Sikka +3 more | 2011-04-19 |
| 7917328 | Tracking thermal mini-cycle stress | Jon A. Casey, Michael Stephen Floyd, Soraya Ghiasi, Jennifer V. Muncy, Malcom S. Ware +1 more | 2011-03-29 |