Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7928562 | Segmentation of a die stack for 3D packaging thermal management | Amilcar R. Arvelo, Evan G. Colgan, John Harold Magerlein, Kenneth C. Marston, Kamal K. Sikka +3 more | 2011-04-19 |