Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8037594 | Method of forming a flip-chip package | Jeffrey T. Coffin, Michael A. Gaynes, David L. Questad, Hilton T. Toy, Jamil A. Wakil | 2011-10-18 |
| 7992627 | Microjet module assembly | Raschid J. Bezama, Govindarajan Natarajan, Hilton T. Toy | 2011-08-09 |
| 7928562 | Segmentation of a die stack for 3D packaging thermal management | Amilcar R. Arvelo, Evan G. Colgan, John Harold Magerlein, Kenneth C. Marston, Kathryn C. Rivera +3 more | 2011-04-19 |
| 7875972 | Semiconductor device assembly having a stress-relieving buffer layer | Virendra R. Jadhav, Jiantao Zheng | 2011-01-25 |