Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7952207 | Flip-chip assembly with organic chip carrier having mushroom-plated solder resist opening | Jayshree Shah, Kamalesh K. Srivastava | 2011-05-31 |
| 7875972 | Semiconductor device assembly having a stress-relieving buffer layer | Kamal K. Sikka, Jiantao Zheng | 2011-01-25 |