JC

Jeffrey T. Coffin

IBM: 1 patents #3,726 of 9,568Top 40%
📍 Wappingers Falls, NY: #50 of 111 inventorsTop 50%
🗺 New York: #3,659 of 10,473 inventorsTop 35%
Overall (2011): #270,984 of 364,097Top 75%
1
Patents 2011

Issued Patents 2011

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
8037594 Method of forming a flip-chip package Michael A. Gaynes, David L. Questad, Kamal K. Sikka, Hilton T. Toy, Jamil A. Wakil 2011-10-18