Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8037594 | Method of forming a flip-chip package | Jeffrey T. Coffin, David L. Questad, Kamal K. Sikka, Hilton T. Toy, Jamil A. Wakil | 2011-10-18 |
| 8026730 | Process for measuring heat spreader tilt | Edward J. Yarmchuk | 2011-09-27 |
| 8008122 | Pressurized underfill cure | Jae-Woong Nah, Satoru Katsurayama | 2011-08-30 |