Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8037594 | Method of forming a flip-chip package | Jeffrey T. Coffin, Michael A. Gaynes, David L. Questad, Kamal K. Sikka, Jamil A. Wakil | 2011-10-18 |
| 8021925 | Thermal paste containment for semiconductor modules | David L. Edwards, Sushumna Iruvanti, Wei Zou | 2011-09-20 |
| 7992627 | Microjet module assembly | Raschid J. Bezama, Govindarajan Natarajan, Kamal K. Sikka | 2011-08-09 |