Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8021925 | Thermal paste containment for semiconductor modules | David L. Edwards, Sushumna Iruvanti, Hilton T. Toy | 2011-09-20 |
| 7898076 | Structure and methods of processing for solder thermal interface materials for chip cooling | Bruce K. Furman, Madhusudan K. Iyengar, Paul A. Lauro, Yves Martin, Roger R. Schmidt +2 more | 2011-03-01 |