Issued Patents 2011
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8077462 | Stress relieved hose routing to liquid-cooled electronics rack door | Wayne A. Barringer, David P. Graybill, Madhusudan K. Iyengar, James J. Steffes, Gerard V. Weber, Jr. | 2011-12-13 |
| 8051897 | Redundant assembly for a liquid and air cooled module | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2011-11-08 |
| 8038343 | Apparatus for thermal characterization under non-uniform heat load | Hendrik F. Hamann, Madhusudan K. Iyengar, James A. Lacey | 2011-10-18 |
| 8029186 | Method for thermal characterization under non-uniform heat load | Hendrik F. Hamann, Madhusudan K. Iyengar, James A. Lacey | 2011-10-04 |
| 8020298 | Method of fabricating a heat exchanger with angled secondary fins extending from primary fins | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2011-09-20 |
| 8009430 | Techniques for data center cooling | Alan Claassen, Hendrik F. Hamann, Madhusudan K. Iyengar, James A. Lacey, Yves Martin +1 more | 2011-08-30 |
| 7979250 | Method of laying out a data center using a plurality of thermal simulators | Matthew R. Archibald, Richard C. Chu, Hendrik F. Hamann, Madhusudan K. Iyengar | 2011-07-12 |
| 7978473 | Cooling apparatus with cold plate formed in situ on a surface to be cooled | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Bruce K. Furman, Madhusudan K. Iyengar +3 more | 2011-07-12 |
| 7967062 | Thermally conductive composite interface, cooled electronic assemblies employing the same, and methods of fabrication thereof | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Keith E. Fogel, Madhusudan K. Iyengar +1 more | 2011-06-28 |
| 7963118 | Vapor-compression heat exchange system with evaporator coil mounted to outlet door of an electronics rack | Donald W. Porter, Jyunji Takayoshi, Takeshi Tsukamoto, Yasuharu Yamada | 2011-06-21 |
| 7950244 | Apparatus for facilitating cooling of an electronics rack through the use of an air-to-liquid heat exchanger | Madhusudan K. Iyengar, Howard P. Welz | 2011-05-31 |
| 7948757 | Multi-fluid cooling of an electronic device | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2011-05-24 |
| 7898076 | Structure and methods of processing for solder thermal interface materials for chip cooling | Bruce K. Furman, Madhusudan K. Iyengar, Paul A. Lauro, Yves Martin, Da-Yuan Shih +2 more | 2011-03-01 |