Issued Patents 2011
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8043893 | Thermo-compression bonded electrical interconnect structure and method | Jae-Woong Nah | 2011-10-25 |
| 8002477 | Devices and methods for side-coupling optical fibers to optoelectronic components | Evan G. Colgan, Fuad E. Doany, Daniel J. Stigliani, Jr. | 2011-08-23 |
| 7978473 | Cooling apparatus with cold plate formed in situ on a surface to be cooled | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Paul A. Lauro +3 more | 2011-07-12 |
| 7952193 | Method and apparatus for deploying a liquid metal thermal interface for chip cooling | Yves Martin, Theodore G. van Kessel | 2011-05-31 |
| 7898076 | Structure and methods of processing for solder thermal interface materials for chip cooling | Madhusudan K. Iyengar, Paul A. Lauro, Yves Martin, Roger R. Schmidt, Da-Yuan Shih +2 more | 2011-03-01 |
| 7868457 | Thermo-compression bonded electrical interconnect structure and method | Jae-Woong Nah | 2011-01-11 |
| 7863070 | Methods for encapsulating microelectromechanical (MEM) devices on a wafer scale | Evan G. Colgan, Christopher V. Jahnes | 2011-01-04 |