Issued Patents 2011
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8039314 | Metal adhesion by induced surface roughness | Danielle DeGraw, Peter J. Lindgren, Ping-Chuan Wang | 2011-10-18 |
| 8026613 | Interconnections for flip-chip using lead-free solders and having reaction barrier layers | Keith E. Fogel, Balaram Ghosal, Sung Kwon Kang, Stephen Kilpatrick, Paul A. Lauro +2 more | 2011-09-27 |
| 8003512 | Structure of UBM and solder bumps and methods of fabrication | Luc Belanger, Marc A. Bergendahl, Ajay P. Giri, Paul A. Lauro, Valerie Oberson | 2011-08-23 |
| 7978473 | Cooling apparatus with cold plate formed in situ on a surface to be cooled | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Bruce K. Furman, Madhusudan K. Iyengar +3 more | 2011-07-12 |
| 7932169 | Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers | Luc Belanger, Stephen L. Buchwalter, Leena Paivikki Buchwalter, Ajay P. Giri, Jonathan H. Griffith +8 more | 2011-04-26 |
| 7928585 | Sprocket opening alignment process and apparatus for multilayer solder decal | Stephen L. Buchwalter, Peter A. Gruber, Jae-Woong Nah | 2011-04-19 |
| 7923849 | Interconnections for flip-chip using lead-free solders and having reaction barrier layers | Keith E. Fogel, Balaram Ghosal, Sung Kwon Kang, Stephen Kilpatrick, Paul A. Lauro +2 more | 2011-04-12 |
| 7898076 | Structure and methods of processing for solder thermal interface materials for chip cooling | Bruce K. Furman, Madhusudan K. Iyengar, Paul A. Lauro, Yves Martin, Roger R. Schmidt +2 more | 2011-03-01 |