Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7980446 | Micro-fluidic injection molded solder (IMS) | Peter A. Gruber, Paul A. Lauro, Jae-Woong Nah | 2011-07-19 |
| 7936060 | Reworkable electronic device assembly and method | Paul S. Andry, George A. Katopis, John U. Knickerbocker, Stelios G. Tsapepas, Bucknell C. Webb | 2011-05-03 |
| 7932169 | Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers | Luc Belanger, Leena Paivikki Buchwalter, Ajay P. Giri, Jonathan H. Griffith, Donald W. Henderson +8 more | 2011-04-26 |
| 7928585 | Sprocket opening alignment process and apparatus for multilayer solder decal | Peter A. Gruber, Jae-Woong Nah, Da-Yuan Shih | 2011-04-19 |