Issued Patents 2011
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8080876 | Structure and method for creating reliable deep via connections in a silicon carrier | Paul S. Andry, Michelle L. Steen, Cornelia K. Tsang | 2011-12-20 |
| 8048794 | 3D silicon-silicon die stack structure and method for fine pitch interconnection and vertical heat transport | — | 2011-11-01 |
| 8012796 | Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers | Paul S. Andry, John M. Cotte, Cornelia K. Tsang | 2011-09-06 |
| 8008764 | Bridges for interconnecting interposers in multi-chip integrated circuits | Douglas J. Joseph | 2011-08-30 |
| 7952205 | Injection molded soldering process and arrangement for three-dimensional structures | Luc Belanger, David Danovitch | 2011-05-31 |
| 7936060 | Reworkable electronic device assembly and method | Paul S. Andry, Stephen L. Buchwalter, George A. Katopis, Stelios G. Tsapepas, Bucknell C. Webb | 2011-05-03 |
| 7902069 | Small area, robust silicon via structure and process | Paul S. Andry, John M. Cotte, Cornelia K. Tsang | 2011-03-08 |
| 7892885 | Techniques for modular chip fabrication | Alain Caron | 2011-02-22 |
| 7863189 | Methods for fabricating silicon carriers with conductive through-vias with low stress and low defect density | Veeraraghaven S. Basker, John M. Cotte, Hariklia Deligianni, Keith Kwietniak | 2011-01-04 |