Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8003512 | Structure of UBM and solder bumps and methods of fabrication | Luc Belanger, Marc A. Bergendahl, Paul A. Lauro, Valerie Oberson, Da-Yuan Shih | 2011-08-23 |
| 7932169 | Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers | Luc Belanger, Stephen L. Buchwalter, Leena Paivikki Buchwalter, Jonathan H. Griffith, Donald W. Henderson +8 more | 2011-04-26 |