MB

Marc A. Bergendahl

IBM: 1 patents #3,726 of 9,568Top 40%
📍 Troy, NY: #13 of 55 inventorsTop 25%
🗺 New York: #3,659 of 10,473 inventorsTop 35%
Overall (2011): #230,733 of 364,097Top 65%
1
Patents 2011

Issued Patents 2011

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
8003512 Structure of UBM and solder bumps and methods of fabrication Luc Belanger, Ajay P. Giri, Paul A. Lauro, Valerie Oberson, Da-Yuan Shih 2011-08-23