Issued Patents 2011
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8053283 | Die level integrated interconnect decal manufacturing method and apparatus | Peter A. Gruber | 2011-11-08 |
| 8043893 | Thermo-compression bonded electrical interconnect structure and method | Bruce K. Furman | 2011-10-25 |
| 8008122 | Pressurized underfill cure | Michael A. Gaynes, Satoru Katsurayama | 2011-08-30 |
| 7980446 | Micro-fluidic injection molded solder (IMS) | Stephen L. Buchwalter, Peter A. Gruber, Paul A. Lauro | 2011-07-19 |
| 7931187 | Injection molded solder method for forming solder bumps on substrates | Peter A. Gruber, Paul A. Lauro, Kazushige Toriyama | 2011-04-26 |
| 7928585 | Sprocket opening alignment process and apparatus for multilayer solder decal | Stephen L. Buchwalter, Peter A. Gruber, Da-Yuan Shih | 2011-04-19 |
| 7906420 | Method and apparatus for forming planar alloy deposits on a substrate | Peter A. Gruber, Paul A. Lauro | 2011-03-15 |
| 7891538 | Techniques for arranging solder balls and forming bumps | Russell A. Budd, Frank R. Libsch | 2011-02-22 |
| 7867842 | Method and apparatus for forming planar alloy deposits on a substrate | Peter A. Gruber, Paul A. Lauro | 2011-01-11 |
| 7868457 | Thermo-compression bonded electrical interconnect structure and method | Bruce K. Furman | 2011-01-11 |