Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7931187 | Injection molded solder method for forming solder bumps on substrates | Peter A. Gruber, Paul A. Lauro, Jae-Woong Nah | 2011-04-26 |
KT
Kazushige Toriyama
Overall (2011): #248,749 of 364,097Top 70%
1
Patents 2011