Issued Patents 2011
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8053283 | Die level integrated interconnect decal manufacturing method and apparatus | Jae-Woong Nah | 2011-11-08 |
| 8011563 | Compliant mold fill head with integrated cavity venting and solder cooling | Russell A. Budd, Evan G. Colgan, Gareth G. Hougham, John P. Karidis | 2011-09-06 |
| 7980446 | Micro-fluidic injection molded solder (IMS) | Stephen L. Buchwalter, Paul A. Lauro, Jae-Woong Nah | 2011-07-19 |
| 7955966 | Injection molded solder ball method | Barry A. Hochlowski, David T. Naugle | 2011-06-07 |
| 7931187 | Injection molded solder method for forming solder bumps on substrates | Paul A. Lauro, Jae-Woong Nah, Kazushige Toriyama | 2011-04-26 |
| 7928585 | Sprocket opening alignment process and apparatus for multilayer solder decal | Stephen L. Buchwalter, Jae-Woong Nah, Da-Yuan Shih | 2011-04-19 |
| 7906420 | Method and apparatus for forming planar alloy deposits on a substrate | Paul A. Lauro, Jae-Woong Nah | 2011-03-15 |
| 7867842 | Method and apparatus for forming planar alloy deposits on a substrate | Paul A. Lauro, Jae-Woong Nah | 2011-01-11 |