Issued Patents 2011
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8054095 | Metalized elastomeric probe structure | Ali Afzali, Steven A. Cordes, Paul W. Coteus, Matthew J. Farinelli, Sherif A. Goma +4 more | 2011-11-08 |
| 8037600 | Method of producing a land grid array interposer structure | Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Stefano S. Oggioni, Enrique Vargas | 2011-10-18 |
| 8011563 | Compliant mold fill head with integrated cavity venting and solder cooling | Russell A. Budd, Evan G. Colgan, Peter A. Gruber, John P. Karidis | 2011-09-06 |
| 7975379 | Method of making a land-grid-array (LGA) interposer | Brian S. Beaman, John Saunders Corbin, Jr., Paul W. Coteus, Shawn A. Hall, Kathleen C. Hinge +3 more | 2011-07-12 |
| 7897878 | Compliant penetrating packaging interconnect | Paul W. Coteus, Brian R. Sundlof | 2011-03-01 |
| 7883919 | Negative thermal expansion system (NTEs) device for TCE compensation in elastomer compsites and conductive elastomer interconnects in microelectronic packaging | S. Jay Chey, James P. Doyle, Xiao Hu Liu, Christopher V. Jahnes, Paul A. Lauro +2 more | 2011-02-08 |
| 7863089 | Planar array contact memory cards | Paul W. Coteus, Kevin C. Gower, Shawn A. Hall, Dale J. Pearson | 2011-01-04 |
| 7863091 | Planar array contact memory cards | Paul W. Coteus, Kevin C. Gower, Shawn A. Hall, Dale J. Pearson | 2011-01-04 |