Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8054095 | Metalized elastomeric probe structure | Gareth G. Hougham, Ali Afzali, Steven A. Cordes, Paul W. Coteus, Matthew J. Farinelli +4 more | 2011-11-08 |
| 7915064 | Processing for overcoming extreme topography | Guy A. Cohen, Steven A. Cordes, Joanna Rosner, Jeannine M. Trewhella | 2011-03-29 |
| 7880305 | Technology for fabrication of packaging interface substrate wafers with fully metallized vias through the substrate wafer | Yu-Ting Cheng, John Harold Magerlein, Sampath Purushothaman, Carlos J. Sambucetti, George F. Walker | 2011-02-01 |