Issued Patents 2011
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7989291 | Anisotropic stress generation by stress-generating liners having a sublithographic width | Lawrence A. Clevenger, Bruce B. Doris, Elbert E. Huang, Carl Radens | 2011-08-02 |
| 7977203 | Programmable via devices with air gap isolation | Kuan-Neng Chen, Lia Krusin-Elbaum, Dennis M. Newns | 2011-07-12 |
| 7968450 | Methods for incorporating high dielectric materials for enhanced SRAM operation and structures produced thereby | Azeez Bhavnagarwala, Stephen V. Kosonocky, Satyanarayana V. Nitta | 2011-06-28 |
| 7969770 | Programmable via devices in back end of line level | Kuan-Neng Chen, Lia Krusin-Elbaum, Dennis M. Newns | 2011-06-28 |
| 7947907 | Electronics structures using a sacrificial multi-layer hardmask scheme | Matthew E. Colburn, Ricardo A. Donaton, Conal E. Murray, Satyanarayana V. Nitta, Sujatha Sankaran +2 more | 2011-05-24 |
| 7948051 | Nonlithographic method to produce self-aligned mask, articles produced by same and compositions for same | Matthew E. Colburn, Stephen M. Gates, Jeffrey Hedrick, Elbert E. Huang, Satyanarayana V. Nitta +1 more | 2011-05-24 |
| 7944055 | Spin-on antireflective coating for integration of patternable dielectric materials and interconnect structures | Robert David Allen, Phillip Brock, Blake Davis, Wu-Song Huang, Qinghuang Lin +2 more | 2011-05-17 |
| 7919225 | Photopatternable dielectric materials for BEOL applications and methods for use | Robert David Allen, Phillip Brock, Blake Davis, Geraud Jean-Michel Dubois, Qinghuang Lin +3 more | 2011-04-05 |
| 7901977 | Data protection by detection of intrusion into electronic assemblies | Marie Angelopoulos, Teresita O. Graham, Steve Weingart | 2011-03-08 |
| 7892940 | Device and methodology for reducing effective dielectric constant in semiconductor devices | Daniel C. Edelstein, Matthew E. Colburn, Edward C. Cooney, III, Timothy J. Dalton, John A. Fitzsimmons +10 more | 2011-02-22 |
| 7880305 | Technology for fabrication of packaging interface substrate wafers with fully metallized vias through the substrate wafer | Yu-Ting Cheng, Sherif A. Goma, John Harold Magerlein, Carlos J. Sambucetti, George F. Walker | 2011-02-01 |
| 7863150 | Method to generate airgaps with a template first scheme and a self aligned blockout mask | Matthew E. Colburn, Daniel C. Edelstein, Satya V. Nitta, Shom Ponth | 2011-01-04 |