Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7990711 | Double-face heat removal of vertically integrated chip-stacks utilizing combined symmetric silicon carrier fluid cavity and micro-channel cold plate | Paul S. Andry, Thomas J. Brunschwiler, Evan G. Colgan | 2011-08-02 |
| 7928562 | Segmentation of a die stack for 3D packaging thermal management | Amilcar R. Arvelo, Evan G. Colgan, Kenneth C. Marston, Kathryn C. Rivera, Kamal K. Sikka +3 more | 2011-04-19 |
| 7880305 | Technology for fabrication of packaging interface substrate wafers with fully metallized vias through the substrate wafer | Yu-Ting Cheng, Sherif A. Goma, Sampath Purushothaman, Carlos J. Sambucetti, George F. Walker | 2011-02-01 |