Issued Patents 2011
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8081473 | Apparatus and method of direct water cooling several parallel circuit cards each containing several chip packages | Thomas M. Cipolla, Paul W. Coteus, Shawn A. Hall, Shurong Tian | 2011-12-20 |
| 8037600 | Method of producing a land grid array interposer structure | Gareth G. Hougham, Brian S. Beaman, Paul W. Coteus, Stefano S. Oggioni, Enrique Vargas | 2011-10-18 |
| 8011563 | Compliant mold fill head with integrated cavity venting and solder cooling | Russell A. Budd, Peter A. Gruber, Gareth G. Hougham, John P. Karidis | 2011-09-06 |
| 8002477 | Devices and methods for side-coupling optical fibers to optoelectronic components | Fuad E. Doany, Bruce K. Furman, Daniel J. Stigliani, Jr. | 2011-08-23 |
| 8004841 | Method and apparatus of water cooling several parallel circuit cards each containing several chip packages | Thomas M. Cipolla, Shurong Tian, Paul W. Coteus, Shawn A. Hall | 2011-08-23 |
| 7990711 | Double-face heat removal of vertically integrated chip-stacks utilizing combined symmetric silicon carrier fluid cavity and micro-channel cold plate | Paul S. Andry, Thomas J. Brunschwiler, John Harold Magerlein | 2011-08-02 |
| 7948077 | Integrated circuit chip module with microchannel cooling device having specific fluid channel arrangement | Paul S. Andry, Lawrence S. Mok, Chirag S. Patel, David E. Seeger | 2011-05-24 |
| 7928562 | Segmentation of a die stack for 3D packaging thermal management | Amilcar R. Arvelo, John Harold Magerlein, Kenneth C. Marston, Kathryn C. Rivera, Kamal K. Sikka +3 more | 2011-04-19 |
| 7888786 | Electronic module comprising memory and integrated circuit processor chips formed on a microchannel cooling device | Paul S. Andry, Lawrence S. Mok, Chirag S. Patel, David E. Seeger | 2011-02-15 |
| 7863070 | Methods for encapsulating microelectromechanical (MEM) devices on a wafer scale | Bruce K. Furman, Christopher V. Jahnes | 2011-01-04 |