Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8011563 | Compliant mold fill head with integrated cavity venting and solder cooling | Evan G. Colgan, Peter A. Gruber, Gareth G. Hougham, John P. Karidis | 2011-09-06 |
| 7980445 | Fill head for full-field solder coverage with a rotatable member | John P. Karidis, Mark D. Schultz | 2011-07-19 |
| 7891538 | Techniques for arranging solder balls and forming bumps | Frank R. Libsch, Jae-Woong Nah | 2011-02-22 |
| 7883277 | Interconnecting (mapping) a two-dimensional optoelectronic (OE) device array to a one-dimensional waveguide array | Punit P. Chiniwalla, John Andrew Guckenberger, Jeffrey A. Kash, Jeremy D. Schaub, Michael R. T. Tan +2 more | 2011-02-08 |