Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8053284 | Method and package for circuit chip packaging | Yves Martin, Theodore Kessel, Xiaojin Wei | 2011-11-08 |
| 8021925 | Thermal paste containment for semiconductor modules | David L. Edwards, Hilton T. Toy, Wei Zou | 2011-09-20 |
| 7981849 | Reversible thermal thickening grease | Claudius Feger, Jeffrey D. Gelorme, Rajneesh Kumar, Ijeoma M. Nnebe | 2011-07-19 |
| 7964542 | Enhanced thermo-oxidative stability thermal interface compositions and use thereof in microelectronics assembly | Krishna G. Sachdev, Mark S. Chace, Normand Cote, David L. Gardell, Jeffrey D. Gelorme +2 more | 2011-06-21 |