Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8054630 | Electronic components on trenched substrates and method of forming same | Vijayeshwar D. Khanna, Jennifer V. Muney, Arun Sharma, Sri M. Sri-Jayantha, Lorenzo Valdevit | 2011-11-08 |
| 8037594 | Method of forming a flip-chip package | Jeffrey T. Coffin, Michael A. Gaynes, Kamal K. Sikka, Hilton T. Toy, Jamil A. Wakil | 2011-10-18 |
| 7875502 | Semiconductor chips with crack stop regions for reducing crack propagation from chip edges/corners | Peter J. Brofman, Jon A. Casey, Ian D. Melville, Wolfgang Sauter, Thomas A. Wassick | 2011-01-25 |
| 7868459 | Semiconductor package having non-aligned active vias | Jean Audet, Luc Guerin, David J. Russell | 2011-01-11 |